Atomic Scale Formation Mechanism of Edge Dislocation Relieving Lattice Strain in a GeSi overlayer on Si(001)

dc.contributorHáskóli Íslandsen_US
dc.contributorUniversity of Icelanden_US
dc.contributor.authorMaras, E.
dc.contributor.authorPizzagalli, L.
dc.contributor.authorAla-Nissila, T.
dc.contributor.authorJónsson, Hannes
dc.contributor.departmentRaunvísindadeild (HÍ)en_US
dc.contributor.departmentFaculty of Physical Sciences (UI)en_US
dc.contributor.schoolVerkfræði- og náttúruvísindasvið (HÍ)en_US
dc.contributor.schoolSchool of Engineering and Natural Sciences (UI)en_US
dc.date.accessioned2018-01-31T11:26:20Z
dc.date.available2018-01-31T11:26:20Z
dc.date.issued2017-09-20
dc.description.abstractUnderstanding how edge misfit dislocations (MDs) form in a GeSi/Si(001) film has been a long standing issue. The challenge is to find a mechanism accounting for the presence of these dislocations at the interface since they are not mobile and cannot nucleate at the surface and glide towards the interface. Furthermore, experiments can hardly detect the nucleation and early stages of growth because of the short time scale involved. Here we present the first semi-quantitative atomistic calculation of the formation of edge dislocations in such films. We use a global optimization method and density functional theory calculations, combined with computations using potential energy functions to identify the best mechanisms. We show that those previously suggested are relevant only for a low film strain and we propose a new mechanism which accounts for the formation of edge dislocations at high film strain. In this one, a 60° MD nucleates as a “split” half-loop with two branches gliding on different planes. One branch belongs to the glide plane of a complementary 60° MD and therefore strongly favors the formation of the complementary MD which is immediately combined with the first MD to form an edge MD.en_US
dc.description.sponsorshipThis work has been supported in part by the Academy of Finland through its COMP CoE (T.A.-N., nos 251748 and 284621) and FiDiPro (E.M. and H.J., no. 263294) grants. We acknowledge computational resources provided by the Aalto Science-IT project and CSC IT Center for Science Ltd in Espoo, Finland. E.M. wishes to thank Oleg Trushin, David Rodney and Emmanuel Clouet for helpful discussions.en_US
dc.description.versionPeer Revieweden_US
dc.format.extent11966en_US
dc.identifier.citationMaras, E., Pizzagalli, L., Ala-Nissila, T., & Jónsson, H. (2017). Atomic Scale Formation Mechanism of Edge Dislocation Relieving Lattice Strain in a GeSi overlayer on Si(001). Scientific Reports, 7(1), 11966. doi:10.1038/s41598-017-12009-yen_US
dc.identifier.doi10.1038/s41598-017-12009-y
dc.identifier.issn2045-2322
dc.identifier.journalScientific Reportsen_US
dc.identifier.urihttps://hdl.handle.net/20.500.11815/553
dc.language.isoenen_US
dc.publisherSpringer Natureen_US
dc.relation.ispartofseriesScientific Reports;7(1)
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectSurfaces, interfaces and thin filmsen_US
dc.subjectTwo-dimensional materialsen_US
dc.subjectEfnafræðien_US
dc.subjectLíkindafræðien_US
dc.titleAtomic Scale Formation Mechanism of Edge Dislocation Relieving Lattice Strain in a GeSi overlayer on Si(001)en_US
dc.typeinfo:eu-repo/semantics/articleen_US
dcterms.licenseThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.en_US

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